A 32×32 Pixel 0.46-to-0.75THz Light-Field Camera SoC in 0.13μm CMOS

Light-field (LF) refers to the spatio-directional light flow in space. In LF imaging, light rays are recorded along different positions and directions, and a 3-D scene is reconstructed with back-propagation [1]. Modern visible-light LF cameras assemble a lens array atop a megapixel (Mpx) count focal-plane array (FPA), such that each lens (macro-pixel) provides spatial sampling while the FPA pixels within a lens (sub-pixels) provide angular sampling [2]. Likewise, THz LF cameras can allow real-time 3D see-through imaging for inspection and screening applications [3]. Unfortunately, THz Mpx FPAs are infeasible as a large THz pixel area (>10× visible-light pixel) would require wafer-scale FPA fabrication, leading to impractical costs and process variations. Multi-chip packaging is an alternative for scaling the THz FPA pixel count, but it requires compact THz camera ICs with serial data interfaces (small pin count) to allow dense integration.

This document is the accepted manuscript version that has been published in final form in: 2021 IEEE International Solid-State Circuits Conference (ISSCC). https://doi.org/10.1109/ISSCC42613.2021.9365832

© 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.


Citation style:
Could not load citation form.


Use and reproduction:
All rights reserved